- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
- Thermal conductivity of more than 1.066 W/m-K
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Operating Temperature: -20C to 100C (-4F to 212F)
72 x 18 x 18mm
Bleed: 0.05% at 200C/24 hours
Evaporation: 0.001% at 200C/24 hours
Specific Gravity: 2.3
Thermal Conductivity: 1.066 W/(m·K)
Thermal Resistance: 0.195C-m2/W